教师简介
姓 名 |
张程 |
|
性 别 |
男 |
出生年月 |
1993.12 |
最高学历、学位 |
博士研究生、博士 |
职 称 |
副教授 |
职 务 |
|
电子邮箱 |
zhangcheng@usts.edu.cn |
一、基本情况:
2012.09-2016.06 苏州大学材料学部 (本科);
2016.09-2021.06 苏州大学材料学部(硕博连读)导师:路建美教授、李华教授;
2019.09-2020.09 新加坡南洋理工大学材料科学与工程学院(联合培养博士),导师:Prof. Qichun Zhang;
2021.07至今 苏州科技大学,物理科学与技术学院,讲师。
二、主要研究领域及成果:
主要从事给受体型有机共轭新材料的设计与合成,开发多种有机半导体薄膜制备技术,并探索其在多进制信息存储领域中的应用。主持校人才引进科研资助项目1项,参与国家和省部级课题3项,参加大学生创新创业省级重点项目1项,主持互联网+项目校级金奖和银奖各1项。曾获苏州工业园区捐赠奖学金、HORIBA Scientific 企业奖学金、鹏旭医药奖学金、学业特等奖学金等。以第一作者/通讯作者身份在Sci. China Mater., Small, ACS Appl. Mater. Inter., Small Sci., J. Mater. Chem. C, Chem. Commun., Org. Chem. Front., Mater. Chem. Front.等国际知名学术期刊上发表SCI论文16篇,合作在Adv. Mater., Chem. Eng. J., Appl. Catal. B等期刊发表SCI论文16篇,总被引240余次,H-index为8,担任Nano Research等期刊特邀审稿人。申请国家专利1项。指导学生发表2区SCI论文1篇,省级大学生创新创业项目1项,申请专利1项。
三、代表性科研成果:
Zhang Cheng*, Li Yang*, Li Zhuang, Jiang Yucheng, Zhang Jinlei, Zhao Run, Zou Jinyun, Wang Yanan, Wang Kuaibing, Ma Chunlan*, Zhang Qichun*. Nanofiber Architecture Engineering Implemented by Electrophoretic-Induced Self-Assembly Deposition Technology for Flash-Type Memristor[J]. ACS Appl. Mater. Interfaces 2022, 14: 3111-3120.
Zhang Cheng*, Li Yang*, Ma Chunlan, Zhang Qichun*. Recent Progress of Organic-Inorganic Hybrid Perovskites in RRAM, Artificial Synapse, and Logic Operation[J]. Small Science 2022, 2: 2100086.
Li Yang*, Zhang Cheng#, Ling Songtao, Ma Chunlan, Zhang Jinlei, Jiang Yucheng, Zhao Run, Li Hua*, Lu Jianmei*, Zhang Qichun*. Toward Highly Robust Nonvolatile Multilevel Memory by Fine Tuning of the Nanostructural Crystalline Solid-State Order[J]. Small 2021, 17: 2100102.
Li Yang*, Zhang, Cheng#, Shi Zhiming, Ma Chunlan*, Wang Jun, Zhang Qichun*. Recent Advances on Crystalline Materials-Based Flexible Memristors for Data Storage and Neuromorphic Applications[J]. Sci. China Mater. 2021, DOI: 10.1007/s40843-021-1771-5.
Li Yang*, Zhang Cheng#, Shi Zhiming, Li Jingni, Qian Qingyun, Ling Songtao, Zhang Yufen, Zhu Xiaolin, Wu Xingzhi, Zhang Jinlei*, Zhao Run, Jiang Yucheng, Zhang Qijian*, Ma Chunlan*. Nonvolatile Ternary Resistive Memory Performance of a Benzothiadiazole-Based Donor-Acceptor Material on ITO-Coated Glass[J]. Coatings 2021, 11: 318.
Zhang Cheng, Li Hua*, Su Yannan, Zhang Qijian, Li Yang, Lu Jianmei*. Controllable and Versatile Electrophoretic Deposition Technology for Monolithic Organic Memory Devices[J]. ACS Appl. Mater. Interfaces 2020, 12: 15482-15490.
Zhang Cheng, Li Hua*, Su Yannan, Yu Fei, Li Chao, Zhang Qichun*, Lu Jianmei*. The Incorporation of the Ionization Effect in Organic Semiconductors Assists in Triggering Multilevel Resistive Memory Behaviors[J]. Mater. Chem. Front. 2020, 4: 3280-3289.
Zhang Cheng, Wang Zongrui, Li Hua*, Lu Jianmei*, Zhang Qichun*. Recent Progress in the Usage of Tetrabromosubstituted Naphthalenetetracarboxylic Dianhydride as a Building Block to Construct Organic Semiconductors and their Applications[J]. Org. Chem. Front. 2020, 7: 3001-3026.
Zhang Cheng, Li Hua*, Lin Shixin, Su Yannan, Zhang Qijian, Li Yang, Wang Kuaibing, Lu Jianmei*. Fabrication of One-Dimensional Organic Nanofiber Networks via Electrophoretic Deposition for a Nonvolatile Memory Device[J]. ACS Appl. Mater. Interfaces 2020, 12: 57254-57263.
Zhang Cheng, Li Yang, Li Hua*, Zhang Qichun, Lu Jianmei*. Overview of Electric-Field-Induced Deposition Technology in Fabricating Organic Thin Films[J]. J. Mater. Chem. C 2020, 9: 374-394.
Zhang Cheng, Li Hua*, Li Zhuang, Li Yang, Zhang Qijian, Lu Jianmei*. Solvent‐Vapor Annealing of Amphiphile/Metal Interface for Orientated Molecular Stacking and Upgraded Resistive Memory Performance[J]. Macromol. Chem. Phys. 2019, 220, 1900334.
Zhang Cheng, Li Yang, Zhou Yan, Zhang Qijian, Li Hua*, Lu Jianmei*. Deriving Highly Oriented Organic Nanofibers and Ternary Memory Performance via Salification-Induced Effects[J]. Chem. Commun. 2018, 54: 10610-10613.
Zhang Cheng, Li Yang, Zhang Qijian, Li Hua*, Xu Qingfeng, He Jinghui, Lu Jianmei(*).Effects of Single Atom N-Substitution in the Molecular Skeleton on Fabricated Film Quality and Memory Device Performance[J]. Crystal Growth & Design 2018, 18: 1432-1436.